Thin just got thinner. LowBoard 2® is the new and improved low build-up panel from OMNIE—thinner than a 5-pence piece.
LowBoard 2® is designed for low build up overlay applications, where an existing floor cannot be replaced. The LowBoard 2® underfloor heating system has a complete build up of 18mm – the height of a 5p coin! (no additional ply covering layers are needed unless tiling is required). This means the panel is 18mm thick to finished floor. The LowBoard 2® underfloor heating system comprises of two panels – a deck panel and a cover panel. The cover panel and deck panels both feature a pipe channel pattern and lock together using OMNIE Locator Technology, wrapping around the warm water pipe. Not only does this make the system very easy to install, the warm water pipe is also as close to the floor surface as possible, improving heat output and delivering fast warm up times.
The 18mm overall thickness of the product is based on using the 6mm cover panel (This is LowBoard 2® Standard). The Plus version has a cover panel which is 8mm thick, therefore the overall product thickness is increased by 2mm if this system is selected.
Our original OMNIE TorFloor 2® system has a 40% higher heat output compared to un-foiled routed chipboard systems. The unique way OMNIE TorFloor 2® is designed both with the AL-HEX heat diffuser and the warm water pipe being as close to the floor finish as possible means TorFloor 2® is the market leading routed chipboard system for both heat output and warm up times. The system produces 77 W/m² at 50 degrees celsius (deg C) flow water temperature.
OMNIE LowBoard 2® features the unique patented AL-HEX foil diffuser, pre bonded to the underside of the cover panel. This means that the foil diffuser is as close to the floor surface as possible. The AL-HEX heat diffuser is designed to break evenly and wrap over and around the pipe, this means that the foil diffuser (which is part of the upper panel) has more surface area in contact with the heating pipe, transferring more heat into the upper panel and minimising heat losses. To aid installation, AL-HEX foil makes a unique 'click' when it is placed over the warm water pipe - so when the cover panel is slotted into place, it is easy to make sure that the foil has wrapped over the pipe by listening for the 'click'.
Unlike competitor products, OMNIE LowBoard 2® cover and lower panels both feature a pre-cut pipe channel pattern. This allows the cover panel to locate and slot over the laid pipe, ensuring an easy to install system which is solid but also thinner than a 5 pence piece.
OMNIE LowBoard 2® deck panels feature a unique fluted exit pre-cut into the pipe channel pattern where it exits the panel. This feature means that the panels do not have to be aligned precisely and makes sure that the warm water pipe, when laid – can easily be pushed into adjacent panels without the risk of kinking or damage. This significantly speeds up the installation time for OMNIE LowBoard 2®.
The OMNIE LowBoard 2® system is designed to work at very low water temperatures. This means the system is perfect for heat pumps, which are optimised to provide flow water temperatures of between 35 deg C and 55 deg C. Installing OMNIE LowBoard 2® in your next project either alongside a heat pump or with another heat source, will significantly reduce your energy bills. OMNIE will ensure that your system is designed correctly and that the heat output is sufficient for the desired indoor environment.
OMNIE LowBoard 2® has a selection of optional cover panels. Each panel comes with an AL-HEX foil diffuser and locator technology, and is designed to make sure the floor when laid, it is ready to accept any chosen floor finish. The cover panel choices also allow professional installers to choose a material they are familiar with or would prefer.
OMNIE LowBoard 2® features the original and first to market, surface printed cover panel. This panel shows the Omnidirectional pipe pattern on the floor face of the board, as well as warning notices. The printed cover panel ensures that the pipe is not damaged when the system is installed and speeds up the fitting of the cover panel in combination with our unique OMNIE LowBoard 2® locator technology.
OMNIE LowBoard 2® benefits from the original Omnidirectional pipe pattern. This pre-cut pipe channel pattern means that the pipe can be laid in a number of different directions without having to make changes to the panels on site. OMNIE LowBoard 2® panels can be laid across the room and the pipe simply and quickly inserted to avoid or work around objects such as built in furniture, pillars or awkward room shapes. Omnidirectional pipe pattern technology significantly improves installation time and reduces risk.
LowBoard® 2 is a low build-up underfloor heating system laid over an existing floor. The system provides a way for underfloor heating to be installed in the lowest possible build-up, minimising the impact on floorto- ceiling height. LowBoard 2® Standard features a 12mm woodfibre deck panel with a 6mm woodfibre cover panel. These perfectly align around the water pipe providing a surface ready for the floor finish to be laid over. The design of LowBoard 2® places the water pipe closer to the floor surface to deliver a fast warm up time. AL HEX diffuser technology improves the spread of heat across the floor.
Introducing LowBoard® 2 Plus, an innovative underfloor heating solution designed for minimal build-up over existing floors. This system offers a low-profile installation, ensuring a minimal impact on floor-to-ceiling height. Featuring a 8mm cement particle board cover panel, placed over a standard 12mm woodfibre deck panel, LowBoard 2® Plus delivers superior strength, acoustic insulation, and thermal efficiency. The design of LowBoard 2® Plus places the water pipe closer to the floor surface, resulting in a rapid warm-up time. Enhanced by AL HEX diffuser technology, this system ensures an even and efficient distribution of heat across the floor.
LowBoard® 2 is a low build-up underfloor heating system laid over an existing floor. The system provides a way for underfloor heating to be installed in the lowest possible build-up, minimising the impact on floor-to-ceiling height. LowBoard 2® Insulate provides an insulated layer by using a 16mm expanded polystyrene (EPS) deck panel with the standard 6mm woodfibre cover panel so is suitable to be laid over uninsulated subfloors.
LowBoard® 2 is a low build-up underfloor heating system laid over an existing floor. The system provides a way for underfloor heating to be installed in the lowest possible build-up, minimising the impact on floor-to-ceiling height. LowBoard 2® Insulate Plus provides an insulated layer by using a 16mm expanded polystyrene (EPS) deck panel with the standard 8mm cement particle board cover panel.